JPS62190344U - - Google Patents

Info

Publication number
JPS62190344U
JPS62190344U JP1986080585U JP8058586U JPS62190344U JP S62190344 U JPS62190344 U JP S62190344U JP 1986080585 U JP1986080585 U JP 1986080585U JP 8058586 U JP8058586 U JP 8058586U JP S62190344 U JPS62190344 U JP S62190344U
Authority
JP
Japan
Prior art keywords
chip
component
circuit board
chip component
board pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986080585U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986080585U priority Critical patent/JPS62190344U/ja
Publication of JPS62190344U publication Critical patent/JPS62190344U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Wire Bonding (AREA)
JP1986080585U 1986-05-26 1986-05-26 Pending JPS62190344U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986080585U JPS62190344U (en]) 1986-05-26 1986-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986080585U JPS62190344U (en]) 1986-05-26 1986-05-26

Publications (1)

Publication Number Publication Date
JPS62190344U true JPS62190344U (en]) 1987-12-03

Family

ID=30931521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986080585U Pending JPS62190344U (en]) 1986-05-26 1986-05-26

Country Status (1)

Country Link
JP (1) JPS62190344U (en])

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101042A (ja) * 1985-10-28 1987-05-11 Minolta Camera Co Ltd Icチツプの基板への搭載構造

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62101042A (ja) * 1985-10-28 1987-05-11 Minolta Camera Co Ltd Icチツプの基板への搭載構造

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